Application Scope:
Used for oxide removal from common copper products such as red copper and brass.
Common Process Flow:
HMT-710 Copper Chemical Polishing Cleaner, used as supplied, room-temperature immersion for 30 seconds–2 minutes →
Water rinse 3 times → Pure-water rinse 1–2 times → 10%–15% 103A Copper Protector, room-temperature immersion for 2–5
minutes → Pure-water rinse 3 times → Drying



